Tuesday, 17 November 2015

Micro Flex Bend Test On Cell Phone Components

A Tinius Olsen testing machine can be used to test the performance and strength of the very “BIG” say a piece 40mm diameter reinforcing bar ripping it apart under a tensile load of 889,644 N (90 metric tons force) or the very “small” say micro electronic and electrical components, forces less than 5 N . Testing electronic components requires small attachments which are fitted to the tension compression materials testing machine to hold the material under test and apply the required force. Recently we supplied a tension compression system which included a micro flex bend attachment to facilitate bend tests on flexible membranes used in mobile and cell phones.

The unit pictured part 99-1004733-330-034 is a variable span (can be adjusted by the user) 3 point flexural bend attachment with a span up to 30mm and points of contact diameter 3mm.

Pictured here with a 5N load cell (Force measuring device) mounted on the testing machine through which the loading force is applied and measured.

The same Tinius Olsen system can be used to perform tests on components in tensile, peel and shear by simply changing the specimen support attachments and selecting the predefined test method from the library of methods in the Tinius Horizon materials testing software. Equally by adding a temperature chamber tests can be performed not just at ambient but at low and elevated temperatures allowing for performance comparison under differing conditions.


Anonymous said...

can you please explain that mechanism of that shaft in moving the bottom supports..
please help me

Vivek Kant said...

The bottom part of the flexural attachment pictured is held stationary fixed to the compression testing machine. It is the upper part fixed to the moving member of the compression testing machine that moves down and applies the force to the component being tested. That component is placed on the lower attachment across the two points of contact, the moving upper point of contact causes the bending of the component. Hope this answers your question.